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Principal Engineer – Power Semiconductor Packaging (f/m/div)*


Do you consider yourself an innovative person? Would you like to manage innovation projects and create new things? Do you want to take on an exciting new challenge and be part of a Technology Pre-Development Innovation group? Apply now and join us as a Principal Engineer – Power Semiconductor Packaging. Responsibilities

In this role you will work closely with internal business units to evaluate the feasibility of designs/concepts, in conjunction with existing and new subcontractors’ suppliers.

In your new role you will:

Manage innovation projects from definition to completion to evaluate novel packaging solutions;

Assess capabilities of package subcontractors as potential suppliers and maintain company database for key subcontractor's capabilities;

Provide technical guidance to the development teams on design, process flow analysis, and materials selection, while working together with subcontractors and materials suppliers to narrow down productive solutions;

Work with internal development teams and subcontractors on developing package platforms for semiconductor devices ;

Contribute to problem-solving and risk analysis on platform development projects;

Take part in competitive analysis + IP generation activities .

Your Profile

You have a structured, self-driven working style with a strong focus on innovation and efficiency. You are a true team player and you love interdisciplinary work involving other departments and teams. Moreover, you know how to communicate in a clear, structured and professional manner.

You are best equipped for this role if you have:

A degree in Physics, Materials sciences, Electronic/Electrical engineering , or similar fields of studies;

At least 10 years of experience working in semiconductor package development or the semiconductor industry ;

A thorough understanding of semiconductor packaging technology, design limitations, materials, and manufacturing processes would be preferred;

Experience in some of the following processes: wafer sawing, die bonding, wire bonding (wedge bonding and ball bonding), molding, trim/singulation, and laser marking is a plus;

Flexibility to travel when required;

Fluency in English (mandatory).

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